What is the full form of DIP in Computer?

Full form of DIP: Here, we are going to learn what does DIP stands for? DIP – which is an abbreviation of "Dual In-line Package" in Computer Acronyms/Abbreviations, etc.
Submitted by Anushree Goswami, on December 02, 2020

DIP: Dual In-line Package

DIP is an abbreviation of "Dual In-line Package". A dual in-line package (DIP) is a semiconductor-based package in the subfield of electronics known as microelectronics with a rectangular covering and also contains two corresponding line ups of electrical connecting pins. Generally, a DIP is alluded to as a DIPn, where n denotes the overall number of pins.

Commonly, the packaging of DIPs is prepared by the use of an opaque molded epoxy plastic forced down just about a tin, silver, or gold-plated lead frame to holds up the device die and make available connection pins. They can be placed on the integrated circuits either using through-hole soldering or in sockets. They are also used among breadboards, which are transitory mounting collections in case of learning, design advancement, and growth or device testing.

History

  • In 1964, Bryant "Buck" Rogers designed and developed the first actual dual-in-line package.
  • In the period of 1970s and 1980s, DIPs uses were most conventional in the field of microelectronics business.
  • All throughout the 1990s, those devices which contain less than 20 leads in numbers were created and produced in a DIP format along with the latest formats.

DIP package

The devices present in the DIP package comprises:

  • DIP switches
  • Bargraph displays
  • LEDsegmented
  • Resistor networks
  • Electromechanical relays

Modifications

A number of DIP modifications for integrated circuits are:

  • Ceramic Dual In-line Package (CERDIP or CDIP)
  • Plastic Dual In-line Package (PDIP)
  • Shrink Plastic Dual In-line Package (SPDIP)
  • Skinny Dual In-line Package (SDIP)

Reference: Dual in-line package


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