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What is the full form of IC?

Full form of IC: Here, we are going to learn about the IC, full form of IC, overview, classification, advantages and disadvantages of IC.
Submitted by Anushree Goswami, on November 27, 2019

IC: Integrated Circuit

IC is an abbreviation of the Integrated Circuit. It is a compact size electronic gadget made of semiconductor material. It comprises of numerous microscopic components like transistors, diodes, capacitors, and resistors. All these components on a thin sheet of semiconductor material are interlinked and manufactured as a single unit, specifically silicon.

In a diversity of devices, ICs are used like microprocessors, television sets, automobiles, audio equipment, video equipment, and mobiles. It is also known as a chip or microchip. It was mainly constructed with the purpose of putting down as many transistors as possible on a semiconductor chip.

In 1958, the first IC or microchip was developed by Jack Kilby.

IC full form

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There are various generations of developments happened through which ICs have gone through and through these successive developments made ICs comprise additional transistors and other electronic elements and as specified they can be categorized as,

  • Small Scale Integration (SSI): One to hundred transistors per chip or IC.
  • Medium Scale Integration (MSI): IC with Hundreds to thousands of transistors.
  • Large Scale Integration (LSI): IC with thousands to several hundred thousand transistors.
  • Very Large Scale Integration (VLSI): Hundred thousand to one million transistors per chip or IC.
  • Ultra-large Scale Integration (ULSI): IC with millions or billions of transistors per chip. E.g. computer processor.

An IC can also be categorized as; Analogue IC, Digital IC or a combination of both.


  • As compared to discrete circuit, the complete physical size of IC is very small.
  • As compared to complete discrete circuits, the weight of an IC is extremely less.
  • It's highly reliable.
  • It has lower power consumption because of its smaller size.
  • In case of failure, it can simply replace but it can barely repair.
  • It has improved operating speed because of an absence of parasitic and capacitance effect.
  • Differences in temperature between elements of a circuit are small.
  • It is appropriate for the functioning of minimal signal.


  • Fabrication of coils or indicators cannot be possible.
  • It can manage only a quantity of power which is limited.
  • P-N-P assembly of High grade is not possible.
  • To successfully reach the low-temperature coefficient, is strenuous.
  • The dissipation of power is restricted to 10 watts.
  • The functioning of low noise and high voltage are not easily acquired.
  • Inductors and transformers are required linking connectivity to exterior to the semiconductor chip as fabrication of inductor and transformers on the semiconductor chip surface is not possible.
  • Fabrication cannot be directly possible to Inductors.


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